CONTACT RESISTANCE MEASURING METHOD, CONTACT RESISTANCE MEASURING DEVICE AND SEMICONDUCTOR WAFER

摘要

PROBLEM TO BE SOLVED: To provide a technology for measuring a contact resistance between a pad for inputting/outputting a signal into/from a semiconductor integrated circuit and a probe, while acquiring information on the contact resistance between the pad for contact resistance measurement and the probe in contact therewith.;SOLUTION: This contact resistance measuring method has a step for bringing the first probe 21 into contact with the first pad 5 connected to the semiconductor integrated circuit 4, a step for bringing the second probe 22 into contact with the second pad 6 connected electrically to the first pad 5, a step for bringing the third probe 23 into contact with the third pad 7 connected electrically to the first pad 5, a step for measuring the first resistance R₁ between the first probe 21 and the second probe 22, a step for measuring the second resistance R₂ between the second probe 22 and the third probe 23, a step for measuring the third resistance R₃ between the third probe 23 and the first probe 21, and a step for calculating the contact resistance r₁ between the first probe 21 and the first pad 5 based on the first to third resistances R₁-R₃.;COPYRIGHT: (C)2006,JPO&NCIPI