Semiconductor package for measuring contact resistance and method of measuring contact resistance using the semiconductor package

摘要

The semiconductor package for measuring contact resistance includes a package substrate, a semiconductor chip mounted on the package substrate, a molding material disposed on the package substrate to surround the semiconductor chip, and an electromagnetic interference shielding layer disposed on the side and molding material of the package substrate. It includes. The package substrate includes first to fourth upper wiring layer patterns disposed on the first surface of the substrate body in the first region and in contact with the electromagnetic interference shielding layer, the substrate body having first and second surfaces opposite to each other. And a wiring structure for measuring the pattern resistance disposed in the second region.