The exposure device, through manner and the device production mannered null basic plate which seek the distorted aberration

摘要

PROBLEM TO BE SOLVED: To automatically and highly accurately measure and correct distortion for each wafer processing in a short time by a constitution which has been originally provided in a semiconductor manufacturing device. SOLUTION: In this semiconductor manufacturing device provided with a projection optical system LN for exposing the pattern of an orginal plate RT onto a substrate, positioning means MRX, MRY, IFX, IFY, MX and MY for positioning the substrate to the original plate, a mark detection means OE for detecting a mark formed on the substrate, so as to position the substrate to the pattern of the original plate. An information-processing means CU for obtaining the position of the mark based on the detected result and controlling the positioning means by the information-processing means CU, the images of the respective marks formed by exposing the pattern including the plural marks of the original plate onto the substrate via the projection optical system LN are detected in the mark detection means OE, and the distortion value of the projection optical system LN is obtained based on the detected result.