1 it possesses the spit hole where to manner

摘要

PROBLEM TO BE SOLVED: To punch a thin film of material into small piece of a specified shape with high accuracy, and to feed punched product films easy to charge to a next process in an arranged condition. ;SOLUTION: In a thin film punching method, a die 11 is fixed not to change the positional relationship to a punch 7, a movable pallet 13 which is movable in a horizontal direction is arranged on a lower side of the die, a suction head 16 freely inserted/withdrawn in/from a die hole 12 from a lower part is arranged on a pallet in a vertically movable manner, a product film which is punched by the punch and received by the die hole is lowered to a receiving hole in the movable pallet while sucked by the suction head, and the movable pallet is parallel-translated after the suction head is detached. Similarly, an elevating/ lowering suction head is mounted on the movable pallet without changing the positional relationship between the punch and the die, and the product film is parallel-translated together with the movable pallet while sucking the product film punched in the die hole by the head.;COPYRIGHT: (C)1999,JPO