首页> 外国专利> Production manner of the resistant formation laminated wood and production mannered null conductive layer and resistant formation

Production manner of the resistant formation laminated wood and production mannered null conductive layer and resistant formation

机译:电阻地层层压木的生产方式及生产方式为零的导电层和电阻地层

摘要

PROBLEM TO BE SOLVED: To provide a method of manufacturing a resistance layer laminated member and a method of manufacturing a component using the resistance layer laminated member in which a resistor having a prescribed resistance is formed in a wiring pattern formed by etching.;SOLUTION: The resistance layer laminated member 22 is manufactured, in which the resistor having the prescribed resistance is formed in the wiring pattern by laminating three or more layers of conductive layers 24 having an excellent conductivity and resistor layers 28 having a prescribed specific resistance, activating the respective joined faces at at least a joined plane and laminating and joining the layers in such a manner that the activated faces are butted opposing to each other. Further, components applied for a printed circuit board, an IC package or the like are manufactured by using the resistance layer laminated member 22.;COPYRIGHT: (C)2003,JPO
机译:解决的问题:提供一种电阻层层叠体的制造方法以及使用该电阻层层叠体的部件的制造方法,其中,在通过蚀刻形成的配线图案中形成具有规定电阻的电阻。制造电阻层层叠构件22,其中,通过层叠三层或更多层具有优异导电性的导电层24和具有规定比电阻的电阻层28,从而在布线图案中形成具有规定电阻的电阻,从而分别至少在接合平面处接合面,并且以使激活面彼此相对对接的方式层叠和接合层。此外,通过使用电阻层层叠部件22来制造应用于印刷电路板,IC封装等的部件。版权所有:(C)2003,JPO

著录项

  • 公开/公告号JP3801929B2

    专利类型

  • 公开/公告日2006-07-26

    原文格式PDF

  • 申请/专利权人 東洋鋼鈑株式会社;

    申请/专利号JP20020039548

  • 发明设计人 吉田 一雄;西條 謹二;大澤 真司;

    申请日2002-02-18

  • 分类号B23K20/04;B23K20/14;B23K20/24;H05K1/16;B23K101/36;

  • 国家 JP

  • 入库时间 2022-08-21 21:50:43

相似文献

  • 专利
  • 外文文献
  • 中文文献
获取专利

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号