Semiconductor device exhibits a high degree of pattern recognition when it is irradiated by the machine vision system

摘要

Bumped semiconductor devices that exhibit a high degree of pattern recognition when illuminated by the machine vision system (10). On one surface, a semiconductor device according to the present invention comprises a solder bump having a substantially same plane (16), and a coating film made of the underfill material. Changing the optical properties of the solder bumps deposited selectively flux composition for solder bumps on the two, containing image-modifying agent (18) at least arranged in an array, the semiconductor device when illuminated by a light wavelength selection, and to appear bright in contrast to the background of the underfill material and the solder bumps.