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Film thickness distribution analysis method, electronic circuit board, and manufacturing process design apparatus
Film thickness distribution analysis method, electronic circuit board, and manufacturing process design apparatus
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机译:膜厚分布分析方法,电子电路板及制造工序设计装置
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摘要
The object of the present invention is to provide a film thickness distribution analysis method that ensures quick and effective prediction of film thickness distribution by computer simulation in the pattern plating process. On the circuit pattern of a printed circuit board, in the method for analyzing the thickness distribution of metal film plated selectively, hypothetically dividing the printed circuit board into one or more regions, introducing pattern density thetaj=Aj/Sj (Sj: the area Sj of a desired region j, and Aj: the area of the plated surface inside the area j), and calculating the approximate average current density or film thickness distribution based on "approximation averaged by pattern density".
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机译:发明内容本发明的目的是提供一种膜厚分布分析方法,其通过在图案镀覆过程中的计算机仿真来确保快速且有效地预测膜厚分布。在印刷电路板的电路图案上,在用于分析选择性镀覆的金属膜的厚度分布的方法中,假设将印刷电路板划分为一个或多个区域,引入图案密度thetaj = Aj / Sj(Sj:面积Sj然后,将期望的区域j的面积设为Δj,将区域j)的内侧的镀敷面的面积设为Aj,根据“通过图案密度求出的近似值”,算出近似的平均电流密度或膜厚分布。
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