SILICON SUBSTRATE PROCESSING METHOD, DIE FOR OPTICAL ELEMENT, MOTHER DIE OF DIE FOR OPTICAL ELEMENT, OPTICAL ELEMENT, AND DIFFRACTION GRATING

摘要

PPROBLEM TO BE SOLVED: To provide a silicon substrate processing method by which a three-dimensional shape of below a micron size is accurately processed on the surface of a silicon substrate, to provide a die for an optical element and a mother die of the die for an optical element, which are processed by using the processing method, and also to provide an optical element and a diffraction grating which are processed by the die for an optical element. PSOLUTION: The silicon substrate processing method has the following constitution. A resist is applied on the silicon substrate. The resist is formed into a three-dimensional shape. The three-dimensional shape is formed on the surface of the silicon substrate by processing the silicon substrate with dry etching by making the resist as a mask. The end point of the dry etching is decided on the basis of a degree of the vanishing of the resist mask. The die for an optical element and the mother die of the die for an optical element, which are processed by using the method, and further, the optical element, and the diffraction grating, which are processed by the die for an optical element, are also provided. PCOPYRIGHT: (C)2006,JPO&NCIPI