Method and structure for the temperature control where the high electrical component with respect to many layer LTCC and the LTCC-M board is strengthened

摘要

The multilayer ceramic circuit board includes the core of high conductance material such as metal and the piled layer of the electric insulated ceramics which possesses external surface. According to this invention, with respect to or nearby thermomigration layer and diffused layer external surface one which passes by the ceramics in order to connect to the core thermally or it can provide plural thermal via in the circuit board which receives the high electrical component. Via and diffused layer electric insulated, include the thermal conductivity material. The structure which is obtained gives the high-speed thermal radiation for the high electrical component which with respect to or the vicinity diffused layer it is formed or is mounted, or.