PROBLEM TO BE SOLVED: To provide a machining method by high-power ultra-short pulse laser which controls accurately machining depth in solid organic-compound. SOLUTION: The machining method by high-power ultra-short pulse laser is characterized in that a single high-power ultra-short pulse laser ray applied to solid organic-compound 10, the absorption coefficient of which is not more than 10 m-1, only surface layer of the area where solid organic-compound 10 absorbs a half of laser beam, is machined.
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