Minimization of cooling air preheat for maximum packaging density

摘要

An electronic hardware cabinet includes a forced-air component positioned to force a stream of air to move through the cabinet and at least two electronic assemblies mounted within the cabinet, each of which includes a heat-generating component. The electronic assemblies are positioned so that a portion of the stream of air is heated by a first one of the heat-generating components and, thereafter, that portion of the stream of air moves toward a second one of the heat-generating components. An airflow diverter is positioned between the electronic assemblies to deflect that portion of the stream of air heated by the first heat-generating component to prevent it from reaching the second heat-generating component.