Robust Signal Processing Algorithm For End-Pointing Chemical-Mechanical Polishing Processes

摘要

A signal processing system has the detected mechanical, chemical, optical, electrical, or thermal signals generated during chemical-mechanical polishing (CMP) process collected, analyzed and differentiated with respect to time in-situ, in order to reveal the different stages during CMP for process control and end-pointing purposes. This control and/or end-pointing scheme may be used to detect the interface between two material layers sharing similar properties such as those of low-k dielectric stacks for semiconductor applications.