首页>
外国专利>
Apparatus and manufacturing method of combining low melting point alloys and application of low melting point alloys
Apparatus and manufacturing method of combining low melting point alloys and application of low melting point alloys
展开▼
机译:低熔点合金组合的装置和制造方法以及低熔点合金的应用
展开▼
页面导航
摘要
著录项
相似文献
摘要
An apparatus and a manufacturing method of combining low melting point alloys and an application of low melting point alloys use a low melting point alloy (solder) as a heat-conducting medium. The solder is attached on the surface of a heat sink to define a heat-dissipating device installable onto a heat source (chip) for facilitating heat dissipations. The coefficient of thermal conduction of the solder is high, so that the heat produced by the chip can be conducted to the heat sink to give better heat dissipations of the chip. The characteristic of the low melting point alloy is used to enhance the thermal conduction for the heat source of the chip.
展开▼