Multilayer structure with device for improving integrity of signals propagating between signal layers

摘要

A multilayer structure comprising a plurality of signal layers and at least one conductive layer other than the signal layers. The multilayer structure also comprises a conductor having a first portion and a second portion contiguous to the first portion, the first portion interconnecting a first one of the signal layers and a second one of the signal layers. The second portion of the conductor is at least partly surrounded by a given one of the at least one conductive layer. The multilayer structure further comprises a conductive structure at least partly surrounding the second portion of the conductor and positioned between the second portion of the conductor and the given one of the at least one conductive layer. A current restricting device is electrically connected to the conductor and to the conductive structure. In addition, the multilayer structure comprises an impedance element electrically connected between the conductive structure and a certain one of the at least one conductive layer. A method of manufacturing such a multilayer structure is also provided.