首页>
外国专利>
Process for electroplating metals into microscopic recessed features
Process for electroplating metals into microscopic recessed features
展开▼
机译:将金属电镀成微观凹陷特征的工艺
展开▼
页面导航
摘要
著录项
相似文献
摘要
Several techniques are described for reducing or mitigating the formation of seams and/or voids in electroplating the interior regions of microscopic recessed features. Cathodic polarization is used to mitigate the deleterious effects of introducing a substrate plated with a seed layer into an electroplating solution. Also described are diffusion-controlled electroplating techniques to provide for bottom-up filling of trenches and vias, avoiding thereby sidewalls growing together to create seams/voids. A preliminary plating step is also described that plates a thin film of conductor on the interior surfaces of features leading to adequate electrical conductivity to the feature bottom, facilitating bottom-up filling.
展开▼