首页> 外国专利> Semiconductor structure processing using multiple laser beam spots spaced on-axis on non-adjacent structures

Semiconductor structure processing using multiple laser beam spots spaced on-axis on non-adjacent structures

机译:使用在非相邻结构上同轴排列的多个激光束点进行半导体结构处理

摘要

Methods and systems selectively irradiate structures on or within a semiconductor substrate using a plurality of laser beams. The structures are arranged in a row extending in a generally lengthwise direction. The method generates a first laser beam that propagates along a first laser beam axis that intersects the semiconductor substrate and a second laser beam that propagates along a second laser beam axis that intersects the semiconductor substrate. The method directs the first and second laser beams onto non-adjacent first and second structures in the row. The method moves the first and second laser beam axes relative to the semiconductor substrate along the row substantially in unison in a direction substantially parallel to the lengthwise direction of the row.
机译:方法和系统使用多个激光束选择性地照射半导体衬底上或半导体衬底内的结构。所述结构布置成沿大体上纵向方向延伸的行。该方法产生沿与半导体衬底相交的第一激光束轴传播的第一激光束和沿与半导体衬底相交的第二激光束轴传播的第二激光束。该方法将第一和第二激光束引导到行中不相邻的第一和第二结构上。该方法使第一激光束轴和第二激光束轴相对于半导体衬底沿着该行在基本上平行于该行的长度方向的方向上基本上一致地移动。

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