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Method of testing FPC bonding yield and FPC having testing pads thereon
Method of testing FPC bonding yield and FPC having testing pads thereon
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机译:测试FPC键合成品率的方法和在其上具有测试垫的FPC
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摘要
A flexible printed circuit (FPC) having testing pads thereon is provided. The FPC comprises a plurality of bonding pads and a plurality of testing pads, wherein each of the testing pads is disposed corresponding to each of the bonding pads, and the testing pads are electrically isolated from the bonding pads. After the bonding pads of the FPC are bonded to pins of a display, the testing pads are electrically connected to the bonding pads on the FPC via the pins of the display. Therefore, the FPC bonding yield can be determined by measuring the electrical property of the testing pads.
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