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Method of manufacturing ceramic package sealing structure and ceramic package having said sealing structure

机译:陶瓷封装密封结构的制造方法以及具有该密封结构的陶瓷封装

摘要

The invention provides a ceramic package, a ceramic package having such a sealing structure and a fabrication method of thereof. In the ceramic package, a wall layer made of a plurality of laminated ceramic sheets and having a cavity formed in a central portion thereof is stacked on a top of a base layer made of a plurality of laminated ceramic sheets. A metal layer is coated on the wall layer around the cavity to expose an outer peripheral portion of the wall layer. A glass layer is coated on the outer peripheral portion of the wall layer, which is not coated with the metal layer, to contact with the metal layer. A lid is attached on the metal layer to seal the cavity. The glass layer is coated around the metal layer, which is attached on the ceramic wall layer around the cavity, to reinforce the bonding force between the metal layer and the underlying ceramic wall layer thereby potentially preventing creation of cracks between the metal layer and the underlying ceramic wall layer.
机译:本发明提供了一种陶瓷包装,具有这种密封结构的陶瓷包装及其制造方法。在陶瓷封装中,由多个层叠陶瓷片制成的并且在其中央部分形成有空腔的壁层堆叠在由多个层叠陶瓷片制成的基层的顶部上。在腔周围的壁层上涂覆金属层以暴露壁层的外周部分。玻璃层涂覆在未涂覆金属层的壁层的外周部分上,以与金属层接触。盖附接到金属层上以密封腔。玻璃层涂覆在金属层周围,金属层附着在空腔周围的陶瓷壁层上,以增强金属层与下面的陶瓷壁层之间的结合力,从而潜在地防止在金属层和下面的陶瓷层之间产生裂纹陶瓷墙层。

著录项

  • 公开/公告号US6998002B2

    专利类型

  • 公开/公告日2006-02-14

    原文格式PDF

  • 申请/专利权人 YONG WOOK KIM;

    申请/专利号US20050064967

  • 发明设计人 YONG WOOK KIM;

    申请日2005-02-25

  • 分类号H01L33;

  • 国家 US

  • 入库时间 2022-08-21 21:43:37

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