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Top surface roughness reduction of high-k dielectric materials using plasma based processes
Top surface roughness reduction of high-k dielectric materials using plasma based processes
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机译:使用基于等离子体的工艺降低高k电介质材料的表面粗糙度
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摘要
A system and method for manufacturing semiconductor devices with dielectric layers having a dielectric constant greater than silicon dioxide includes depositing a dielectric layer on a substrate and subjecting the dielectric layer to a plasma to reduce top surface roughness in the dielectric layer.
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