首页> 外国专利> Method of fabricating silicon-on-insulator semiconductor substrate using rare earth oxide or rare earth nitride

Method of fabricating silicon-on-insulator semiconductor substrate using rare earth oxide or rare earth nitride

机译:使用稀土氧化物或稀土氮化物制造绝缘体上硅半导体衬底的方法

摘要

A method of fabricating a semiconductor-on-insulator semiconductor substrate is disclosed that includes providing first and second semiconductor substrates. Either oxygen or nitrogen is introduced into a region adjacent the surface of the first semiconductor substrate and a rare earth is introduced into a region adjacent the surface of the second semiconductor substrate. The surface of the first semiconductor substrate is bonded to the surface of the second semiconductor substrate in a process that includes annealing to react either the oxygen or the nitrogen with the rare earth to form an interfacial insulating layer of either rare earth oxide or rare earth nitride. A portion of either the first semiconductor substrate or the second semiconductor substrate is removed and the surface polished to form a thin crystalline active layer on the insulating layer.
机译:公开了一种制造绝缘体上半导体衬底的方法,该方法包括提供第一和第二半导体衬底。氧或氮被引入与第一半导体衬底的表面相邻的区域,并且稀土被引入与第二半导体衬底的表面相邻的区域。在包括退火以使氧或氮与稀土反应以形成稀土氧化物或稀土氮化物的界面绝缘层的过程中,将第一半导体衬底的表面结合至第二半导体衬底的表面。 。去除第一半导体衬底或第二半导体衬底的一部分,并对其表面进行抛光以在绝缘层上形成薄的晶体活性层。

著录项

  • 公开/公告号US7037806B1

    专利类型

  • 公开/公告日2006-05-02

    原文格式PDF

  • 申请/专利权人 PETAR B. ATANACKOVIC;

    申请/专利号US20050054627

  • 发明设计人 PETAR B. ATANACKOVIC;

    申请日2005-02-09

  • 分类号H01L21/46;H01L21/30;

  • 国家 US

  • 入库时间 2022-08-21 21:42:15

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