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Short-channel Schottky-barrier MOSFET device and manufacturing method

机译:短沟道肖特基势垒MOSFET器件及其制造方法

摘要

A MOSFET device and method of fabricating are disclosed. The present invention utilizes Schottky barrier contacts for source and/or drain contact fabrication within the context of a MOSFET device structure to eliminate the requirement for halo/pocket implants and shallow source/drain extensions to control short channel effects. Additionally, the present invention unconditionally eliminates the parasitic bipolar gain associated with MOSFET fabrication, reduces manufacturing costs, tightens control of device performance parameters, and provides for superior device characteristics as compared to the prior art.
机译:公开了一种MOSFET器件及其制造方法。本发明在MOSFET器件结构的范围内利用肖特基势垒接触件进行源极和/或漏极接触件的制造,从而消除了对光晕/口袋注入和浅源极/漏极延伸的要求,以控制短沟道效应。另外,与现有技术相比,本发明无条件地消除了与MOSFET制造相关的寄生双极增益,降低了制造成本,加强了对器件性能参数的控制,并提供了优异的器件特性。

著录项

  • 公开/公告号US7052945B2

    专利类型

  • 公开/公告日2006-05-30

    原文格式PDF

  • 申请/专利权人 JOHN P. SNYDER;

    申请/专利号US20030360194

  • 发明设计人 JOHN P. SNYDER;

    申请日2003-02-07

  • 分类号H01L21;

  • 国家 US

  • 入库时间 2022-08-21 21:42:02

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