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Chip fabrication procedure and simulation method for chip testing with performance pre-testing

机译:具有性能预测试的芯片测试的芯片制造过程和仿真方法

摘要

The present invention discloses a chip fabrication procedure as well as a simulation method for chip testing with performance pre-testing. The chip fabrication procedure with performance pre-testing comprising steps of: providing a chip design; determining if the chip design is correct by using a simulation environment; determining if the chip performance meets the standards by using a performance testing process; and proceeding with production of chips. The simulation method for chip testing comprises steps of: providing a simulation environment corresponding to a chip design; providing at least one set of testing commands; executing the testing commands; and calculating the time required for completing executing the testing commands. The present invention is advantageous since the time requited for product testing is reduced and so is the fabrication cost.
机译:本发明公开了一种芯片制造程序以及具有性能预测试的芯片测试的仿真方法。具有性能预测试的芯片制造过程包括以下步骤:提供芯片设计;以及通过使用仿真环境确定芯片设计是否正确;通过性能测试过程确定芯片性能是否符合标准;并开始生产芯片。用于芯片测试的仿真方法包括以下步骤:提供与芯片设计相对应的仿真环境;以及提供至少一组测试命令;执行测试命令;并计算完成执行测试命令所需的时间。本发明是有利的,因为减少了用于产品测试的时间,并且减少了制造成本。

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