首页>
外国专利>
Method of connecting an additively and subtractively formed conductive trace and an insulative base to a semiconductor chip
Method of connecting an additively and subtractively formed conductive trace and an insulative base to a semiconductor chip
展开▼
机译:将相加和相减形成的导电迹线和绝缘基底连接到半导体芯片的方法
展开▼
页面导航
摘要
著录项
相似文献
摘要
A method of connecting a conductive trace and an insulative base to a semiconductor chip includes providing a semiconductor chip, a metal base, an insulative base, a routing line and an interconnect, wherein the chip includes a conductive pad, the metal base is disposed on a side of the insulative base that faces away from the chip, the routing line is disposed on a side of the insulative base that faces towards the chip, and the interconnect extends through a via in the insulative base and electrically connects the metal base and the routing line, forming an opening that extends through the insulative base and exposes the pad, forming a connection joint that electrically connects the routing line and the pad, and etching the metal base such that an unetched portion of the metal base forms a pillar that overlaps and is aligned with the via and contacts the interconnect, wherein a conductive trace includes the routing line, the interconnect and the pillar. Preferably, the opening extends through an insulative adhesive that attaches the routing line to the chip.
展开▼