首页> 外国专利> DRIVING MECHANISM FOR CHIP DETACHMENT APPARATUS

DRIVING MECHANISM FOR CHIP DETACHMENT APPARATUS

机译:芯片拆放装置的驱动机制

摘要

ABSTRACTDRIVING MECHANISM FOR CHIP DETACHMENT APPARATUSA driving mechanism and driving method are provided for driving a detachment tool adapted to detach a chip from an adhesive tape to which the chip is mounted. The mechanism comprises a first actuator coupled to the detachment tool and operative to drive the detachment tool to move along a first axis substantially perpendicular to a surface of the chip, and a second actuator coupled to the detachment tool and operative to drive the detachment tool to move adjacent to a width of the chip along a second axis perpendicular to the first axis. The first actuator is configured to drive the detachment tool for programmable movement along the first axis with respect to the chip in conjunction with the second actuator driving the detachment tool for movement adjacent the width of the chip to provide controlled lifting of the chip for propagation of delamination between the chip and the adhesive tape.(FIG. 2)
机译:抽象芯片拆放装置的驱动机制提供了一种用于驱动发动机的驱动机构和驱动方法。分离工具,其适于从胶带上分离芯片,芯片已安装。该机构包括第一致动器,其耦合到拆卸工具,可操作来驱动拆卸工具沿 第一轴线基本垂直于芯片的表面,第二轴线致动器连接到拆卸工具并可操作以驱动拆卸工具,可沿第二轴在芯片的宽度附近移动垂直于第一轴。第一致动器配置成驱动拆卸工具,可沿第一轴相对于第一轴进行可编程运动 与第二个致动器一起驱动芯片驱动拆卸工具用于在切屑宽度附近运动,以提供可控的提举用于在芯片和胶带之间传播分层的芯片。(图2)

著录项

相似文献

  • 专利
  • 外文文献
  • 中文文献
获取专利

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号