COPPER-CONTAINING TIN POWDER AND METHOD FOR PRODUCING THE COPPER-CONTAINING TIN POWDER, AND ELECTROCONDUCTIVE PASTE USING THE COPPER-CONTAINING TIN POWDER

摘要

A copper-containing tin powder, characterized in that it is produced by amethod comprising using a copper powder as a starting material and employing awet substitution process and contains residual copper in an amount of 30 wt %or less; and a method for producing the copper-containing tin powder whichcomprises employing a wet substitution process, wherein a copper powder iscontacted with a plating solution for the substitution with tin, to therebydissolve out a copper component constituting the copper powder and precipitatetin in place of copper. The rate of the change during the above production inpowder characteristics of the powder, such as an average primary particlediameter, is -20 to + 5 %, relative to those of the copper powder used as astarting material. The above copper-containing tin powder is excellent inperformance capabilities of forming a fine wiring circuit and of filling finevia-holes and also fuses at a low temperature.