Method for cutting free plants from soil and a cutting apparatus for cutting through the soil surrounding at least one plant

摘要

The invention relates to a method for cutting free plants by cutting through soil surrounding a plurality of plants. The invention also relates to a cutting apparatus for cutting free plants by cutting through the soil surrounding a plurality of plants. The method comprises the steps of inserting at least a first section of a blade (1) into the soil, cutting through the soil around a plant with the cutting apparatus, displacing the cutting apparatus to a proximity of a second plant, while maintaining at least a part of the blade (1) in the soil during the displacement of the cutting apparatus, and cutting through the soil around the second plant with the cutting apparatus. The method results in a very fast cutting free of plants. The apparatus according to the invention is intended for being vertically positioned at a level higher than the height of the least first plant. The apparatus also results in a very fast cutting free of a plurality of plants in combination with the method according to the invention.