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METHOD FOR ELECTROFORMING A STUDDED PLATE AND A COPY DIE, ELECTROFORMING DIE FOR THIS METHOD, AND COPY DIE

机译:电镀成型板和复印模的方法,用于该方法的电镀模和复印模

摘要

Method for electroforming a plate (20) having a working side provided with separate elevations (22), which method comprises the steps of: providing a flat conductive electroforming die (10) with insulating regions (12) that are separated from one another; electrolytically depositing a screen layer (18), which comprises a network of dykes (30), which dykes (30) delimit screen openings (32), of metal on the electroforming die (10), the dykes (30), as seen in section, having at least one convex surface part; passivating the uncovered surface of the screen layer (18); electrolytically depositing a continuous metal layer (20) on the passivated surface of the screen layer (18), in such a manner that at least the screen openings (32) are filled and the passivated surface is completely covered, separating the continuous metal layer (20) having a working side (52) provided with separate elevations (22), which elevations, when seen in section, have at least one concave surface part (26), as the said plate, from the screen layer (18).
机译:用于电成形具有工作侧的板(20)的方法,该板具有分开的凸起(22),该方法包括以下步骤:提供具有彼此分离的绝缘区域(12)的扁平导电电铸模具(10);电解沉积筛网层(18),该筛网层包括一个堤网(30),该堤网(30)限定了电铸模(10)上金属的筛孔(32)的筛孔(32),如图所示。截面,具有至少一个凸面部分;钝化屏幕层(18)的未覆盖表面;在筛层(18)的钝化表面上电解沉积连续金属层(20),以这样的方式进行:至少填充筛孔(32)并完全覆盖钝化表面,从而将连续金属层( 20)具有工作侧(52),该工作侧具有分开的凸起(22),当从截面上看时,这些凸起具有至少一个从筛层(18)起的凹入表面部分(26),作为所述板。

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