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METHOD FOR ELECTROFORMING A STUDDED PLATE AND A COPY DIE, ELECTROFORMING DIE FOR THIS METHOD, AND COPY DIE
METHOD FOR ELECTROFORMING A STUDDED PLATE AND A COPY DIE, ELECTROFORMING DIE FOR THIS METHOD, AND COPY DIE
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机译:电镀成型板和复印模的方法,用于该方法的电镀模和复印模
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摘要
Method for electroforming a plate (20) having a working side provided with separate elevations (22), which method comprises the steps of: providing a flat conductive electroforming die (10) with insulating regions (12) that are separated from one another; electrolytically depositing a screen layer (18), which comprises a network of dykes (30), which dykes (30) delimit screen openings (32), of metal on the electroforming die (10), the dykes (30), as seen in section, having at least one convex surface part; passivating the uncovered surface of the screen layer (18); electrolytically depositing a continuous metal layer (20) on the passivated surface of the screen layer (18), in such a manner that at least the screen openings (32) are filled and the passivated surface is completely covered, separating the continuous metal layer (20) having a working side (52) provided with separate elevations (22), which elevations, when seen in section, have at least one concave surface part (26), as the said plate, from the screen layer (18).
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