COMPOSITION OF LOW GLASS TRANSITION TEMPERATURE FOR SEMICONDUCTOR ADHESIVE FILM AND THE FILM USING THEREOF

摘要

In the composition of the adhesive film for semiconductors, the semiconductor having a low glass transition temperature comprising an epoxy resin, a rubber resin, the glass transition temperature is 100 ℃ to 150 ℃, the bonding temperature is 120 ℃ to 220 ℃ It relates to a composition of the adhesive film for. Through the composition of the adhesive film for semiconductors having a low glass transition temperature and the adhesive film using the same according to the present invention, the glass transition temperature is significantly lower than that of the conventional product, and after bonding, all in bonding strength, melt flow, TC, etc. It has a good effect. By this invention, low temperature adhesion is possible due to the low glass transition temperature and can have high reliability.