首页> 外国专利> METHOD OF PACKAGING OF FLAT FLUORESCENT LAMP AT THE VACUUM STATE AND VACUUM PACKAGED FLAT FLUORESCENT LAMP USING THE SAME

METHOD OF PACKAGING OF FLAT FLUORESCENT LAMP AT THE VACUUM STATE AND VACUUM PACKAGED FLAT FLUORESCENT LAMP USING THE SAME

机译:在真空状态下包装扁平荧光灯的方法以及使用相同包装的真空包装扁平荧光灯的方法

摘要

Using an O-ring is a flat fluorescent lamp manufactured by a vacuum packaging method and a method of the flat fluorescent lamp in vacuum is disclosed. Vacuum packaging method of the flat fluorescent lamp of the present invention to the back surface substrate and a bottom formed with a discharge electrode to the upper preparing the front substrate phosphor layers formed inlet to the vacuum chamber and a rear substrate via an O-ring on the edge of the rear substrate and after aligning the front substrate by applying pressure between the front substrate and the rear substrate on which the O-ring is compressed between the front substrate and the rear substrate, and thereby vent (vent) of the vacuum chamber. Removing the pressure between the front substrate and the rear substrate, front substrate and the rear substrate is due to the vacuum and external pressure difference between the inside of the front substrate and the rear substrate is a package.
机译:使用O形环的是通过真空包装方法制造的平面荧光灯,并且公开了在真空中的平面荧光灯的方法。将本发明的平面荧光灯真空包装到背面基板和在上方形成有放电电极的底部的真空包装方法,准备在真空室和背面基板上经由O型环的入口形成的正面基板荧光体层。通过在前基板和后基板之间施加压力,在前基板和后基板之间施加O形圈,在前基板和后基板之间施加压力,从而使真空腔室通风。去除前基板和后基板,前基板和后基板之间的压力是由于真空,并且前基板的内部和后基板之间的外部压力差是封装。

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