首页> 外国专利> METHOD FOR DEPOSITION OF TUNGSTEN-SILICIDE AND METHOD FOR FABRICATING OF TUNGSTEN-POLYCIDE GATE ELECTRODE BY USING THE SAME

METHOD FOR DEPOSITION OF TUNGSTEN-SILICIDE AND METHOD FOR FABRICATING OF TUNGSTEN-POLYCIDE GATE ELECTRODE BY USING THE SAME

机译:沉积钨硅化物的方法和钨极栅电极的制造方法

摘要

The present invention is the deposition of tungsten silicide is capable of removing fluorine remaining in the inner chamber after the deposition of tungsten silicide Using that method, and to provide a method for producing a tungsten polycide gate electrode him, the invention is a once deposited and once the cleaning chamber after the deposition process inside the chamber at the time of deposition of tungsten silicide as a single-wafer chamber system default When the chamber cleaning process to reduce the concentration of fluorine remaining NF 3 By using a gas cleaning process and SiH Purge with 4 for the gas to have a degree, to the inner chamber minimizing the concentration of fluorine remaining, whereby there is an effect that it is possible to improve the electrical properties of the gate oxide to reduce the penetration amount of fluorine penetration in the internal tungsten silicide deposited upon subsequent iterations.
机译:本发明是一种能够在沉积硅化钨之后去除残留在内部腔室中的氟的硅化钨的沉积方法,并且提供一种用于制造多晶钨栅电极的方法,本发明是一次沉积并沉积的。一次清洗腔室经过沉积处理,在腔室内部沉积硅化钨时作为单晶片腔系统默认使用当清洗腔室以减少残留的氟浓度NF 3 气体清洁工艺和SiH 用4 进行吹扫以使气体达到一定程度,从而将内腔中的氟含量降至最低,从而有可能改善金属的电性能。栅极氧化物以减少氟在后续迭代过程中沉积在内部硅化钨中的渗透量。

著录项

  • 公开/公告号KR20060001279A

    专利类型

  • 公开/公告日2006-01-06

    原文格式PDF

  • 申请/专利权人 HYNIX SEMICONDUCTOR INC.;

    申请/专利号KR20040050369

  • 发明设计人 EUN YONG SEOK;JI YUN HYUCK;

    申请日2004-06-30

  • 分类号H01L21/205;H01L21/336;

  • 国家 KR

  • 入库时间 2022-08-21 21:27:01

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