A card, a method of manufacturing the card, and a thin type battery for the card

摘要

The invention provides a method of manufacturing a battery built-in type IC card which strongly resists seal breakdown of the battery in a heating and laminating process. The manufacturing method of the invention comprises a battery accommodating step of accommodating a thin type battery (1) in a cavity (79). The cavity (79) for accommodating the battery is formed by overlaying an inner sheet (73) and a first oversheet (74) on a core sheet (72) having a penetration hole (79a). A heating and laminating step involves pressing and heating from above and beneath by disposing a second oversheet (75) so as to put a lid on the cavity (79) and adhering mutually. A spacer (25) is inserted between the seal section (11) of the thin type battery (1) and second oversheet (75), and the heating and laminating step is executed so that the pressing force may be applied to the seal section (11) by way of the spacer (25).