PLATING METHOD A SMALL SIZE PCB AND A PLATING APPARATUS THEREOF

摘要

The present invention relates to a plating method and a plating apparatus of a small printed circuit board , and more particularly to a small in the plating bath having a volume to be made to have a uniform thickness in the plated surface of the small printed circuit board , ; in the method for plating by electrolytic plating on the surface of the small printed circuit board method , and the small negative current inhwae circuit board is attached to the call type in the holding means to be energized by a current amount of fresh water to the plating bath solution to be energized by the positive locking means , by rotating a small repeat , characterized in that the coating It relates to a plating method and a plating apparatus of a printed circuit board .