Pressure-sensitive adhesive with excellent heat resistance and thermal conductivity, adhesive sheets thereof, and fixing methods for electronic components and heat-dissipating materials using the same

摘要

PURPOSE: A pressure sensitive adhesive and a method for securing an electronic component to a heat-radiating member with the adhesive are provided which facilitate bonding of an electronic component to a heat radiating member without the need to consume much time and much workload in bonding treatment. CONSTITUTION: The pressure sensitive adhesive is a product of photopolymerization of a composition comprising:100 pts.wt. of an acrylic monomer mixture or a partial polymerizate thereof, 0.01 to 5 pts.wt. of a polyfunctional (meth)acrylate as a cross -linking agent, 10 to 300 pts.wt. of ceramic powder composed of a covalent bond substance having a total valence electron number of 8 and having a wurtzite or zinc blend crystal structure or a substance having a hexagonal or graphite structure, and 0.01 to 5 pts.wt. of a photopolymerization initiator. The adhesive is free from the danger of peeling and deterioration even when exposed to thermal cycles of quick heating and cooling and has excellent heat resistance and heat conductivity.