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METHOD FOR COATING PHOTO-RESIST BY SLIT SCAN, BLANK MASK HAVING A PHOTO-RESIST FILM COATED BY THE METHOD AND PHOTO MASK MANUFACTURED BY THE SAME
METHOD FOR COATING PHOTO-RESIST BY SLIT SCAN, BLANK MASK HAVING A PHOTO-RESIST FILM COATED BY THE METHOD AND PHOTO MASK MANUFACTURED BY THE SAME
Disclosed are a blank mask having a photoresist film coated by a slit scan method, a photoresist coating method by a slit scan method, and a photo mask manufactured using the same. The bottom surface of the mask coated with the antireflection film and the antireflection film is fixedly mounted on the vacuum chuck, and then a liquid is formed between the coating start area of the mask and the slit nozzle for scan coating. Next, the mask is moved to the first scan speed, the second scan speed and the third scan speed according to the moving distance by driving the vacuum chuck while the top surface of the slit nozzle and the mask are spaced apart from several tens to hundreds of micrometers. The photoresist is applied to the upper surface of the mask. Finally, the solvent contained in the photoresist film coated on the mask is evaporated through natural drying to form a photoresist film having a desired thickness and uniformity on the mask. According to the present invention, it is possible to form a photoresist film having excellent uniformity of a photoresist film having excellent uniformity over the entire area of the mask, and the photoresist film to be used by a user without contamination of the side and back surfaces of the mask by the photoresist. Formation is possible, and internal staining of the photoresist film can be minimized.;Slit nozzle, scan coating, capillary action, photoresist, blank mask, photomask
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