RESIN COMPOSITION FOR CLAD LAMINATION OF FLEXIBLE CIRCUIT BOARD, THE FLEXIBLE METAL LAMINATION BOARD USING THEREOF AND THE METHOD FOR MANUFACTURING THE FLEXIBLE METAL LAMINATION BOARD

摘要

The resin composition of the present invention is an insulating layer flexible circuit boards, flexible teeth using metal laminates and flexible metal laminates relates to a manufacturing method and, more particularly, can reduce the curling of the polyimide was removed by using a photo-thermal curling which may occur due to the water generated during the curing polymer screen used in the manufacture of the flexible substrate insulating layer , instead of the photo-curing process heat insulation to increase the productivity of the flexible circuit board to the introduction of the process layer resin composition, a method of producing them using the flexible metal-clad laminate and a flexible metal-clad laminate. The present invention is achieved through the provision of the insulating layer resin composition of the flexible circuit board which comprises a mixture of a polymer that does not contain the photosensitive group and the polymer containing the photosensitive group in its main chain or side chain.