首页>
外国专利>
SIDE VIEW LED PACKAGE HAVING LEAD FRAME STRUCTURE DESIGNED FOR IMPROVING RESIN FLOW
SIDE VIEW LED PACKAGE HAVING LEAD FRAME STRUCTURE DESIGNED FOR IMPROVING RESIN FLOW
展开▼
机译:侧面LED封装具有设计用于改善树脂流动性的引线框架结构
展开▼
页面导航
摘要
著录项
相似文献
摘要
The invention relates to a side view LED package in use with an LCD backlight unit. The side view LED package comprises: an LED chip; and a strip-shaped lead frame having a toothed structure formed in a lateral edge thereof. The LED chip is mounted on a surface of the lead frame. An integral package body is made of resin, and includes a hollow front half having a cavity for housing the LED chip and a solid rear half divided from the front half by the lead frame. The toothed structure of the lead frame structure can improve resin flow in order to ensure stability even if the LED package is made extremely thin.
展开▼