A method for selective electrodeposition of metal surfaces and selectively - electroplating system for metal surfaces

摘要

A method for selective electrodeposition of metal surfaces with the following process steps:– first masking of the surface areas to be electroplated with a molten, waxy, with water dissolvable substance (14);– second masking of the surface areas not to be electroplated with a liquid dielectric (18);– Detachment of the waxy substance (14) with water (20); and– selective electroplating of the free surface areas.