Inline gluing monitoring system for monitoring of automatic application of glue bead onto workpiece has sensor fitted on glue application device and behind it with regard to direction of application device's direction of movement

摘要

The inline gluing monitoring system for the monitoring of the automatic application of a glue bead (4) onto a workpiece (5) has a sensor (2) fitted on a glue application device (1) and behind it with regard to a direction of movement (V) of the device. An evaluating unit (3) processes the signals transmitted by the sensor regarding the form and/or shape of the glue bead. The sensor has a CCD-chip and may have an integrated light. An independent claim is included for a method for the inline gluing monitoring by using the aforesaid system.