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Making power semiconductor component, forms layered structure containing material of greater dielectric constant and recesses which are filled with semiconductor to form drift zone

机译:制造功率半导体元件,形成包含更高介电常数材料的层状结构以及填充有半导体以形成漂移区的凹槽

摘要

To make the drift zone (34) and layers (32) penetrating it, A layer structure is first formed. This contains material (32) of greater dielectric constant and also recesses (33) on a substrate (30) or on layers provided on it (30). The drift zone is formed by filling (at least in part) the recesses (33) in the layer structure with semiconductor material. An independent claim is included for the corresponding power semiconductor component.
机译:为了使漂移区(34)和层(32)穿透它,首先形成层结构。它包含较高介电常数的材料(32),以及在基板(30)或在基板(30)上提供的层上的凹槽(33)。通过用半导体材料填充(至少部分地)层结构中的凹部(33)来形成漂移区。对于相应的功率半导体组件包括独立权利要求。

著录项

  • 公开/公告号DE102004024344A1

    专利类型

  • 公开/公告日2005-12-22

    原文格式PDF

  • 申请/专利权人 INFINEON TECHNOLOGIES AG;

    申请/专利号DE20041024344

  • 发明设计人 PFIRSCH FRANK;

    申请日2004-05-17

  • 分类号H01L21/336;H01L21/762;H01L29/78;

  • 国家 DE

  • 入库时间 2022-08-21 21:20:55

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