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Ceramic layered microelectronic substrate e.g. for a high temperature operating gas sensor, has resistance to thermal stress using a sandwich with an internal ceramic of lower thermo-elastic modulus
Ceramic layered microelectronic substrate e.g. for a high temperature operating gas sensor, has resistance to thermal stress using a sandwich with an internal ceramic of lower thermo-elastic modulus
A ceramic structure comprises first and second ceramic layers (10', 20'), which are separated by an intermediate ceramic layer (15') of lower thermo-elastic modulus than either of the two outside layers. Multiple layer sandwich structures can be assembled.
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