Inspection, measurement and repair system for use in the semiconductor industry combines a manipulator with inspection, measurement and repair modules with the object under test handled using interfaces to the manipulator

摘要

Inspection, measurement and repair system for the semiconductor industry has a handling arrangement (1) with a manipulator (3) to which an object is delivered. It has a number of module interfaces (6-9) and a number of inspection, measurement and repair modules (10-12), each with a second module interface (13-15) that can be connected to one of the first interfaces. The manipulator loads and unloads the inspection, measurement and repair modules via the connected interfaces.