Method for breaking-up thin, plate-shaped substrate or wafer along scribed line so placing wafer etc. on two-part support

摘要

Thin substrate or wafer (11) is broken-up along scribed line (12) by following steps: wafer is deposited on two-part support (12), whose both parts (13.1,13.2) are foldable towards each other. Wafer placement is such that scribed line is above swivel axis (16) of both support parts.Wafer etc. is used on support and its parts are folded to each other, thus breaking-up weafer etc. along scribed line. Preferably wafer etc. is located on support with scribed line upwards and at least one support part is folded downwards. Alternatively wafer may be placed with scribed line facing downwards and support part(s) is folded upwards. - Independent claims are included for wafer etc. break-up appliance.