Housing for optoelectronic semiconductor chip e.g. light emitting diode, has electrical conductors with chip contact areas provided on sides of chip frame, which are turned away from chip carrier and extend from areas to sides of carrier

摘要

The housing has a base plate with a chip carrier, and a chip frame to define a cavity for arranging a semiconductor chip. Two electrical conductors (6, 7) include chip contact areas (61, 71) on sides of the frame, which are turned away from the carrier. The conductors extend from the areas to sides of the carrier, which are turned away from the frame. The conductors are designed in the form of coatings of parts of the base plate. Independent claims are also included for the following: (A) an optoelectronic component with a housing for mounting a semiconductor chip (B) a method of manufacturing an optoelectronic component.