Producing functional element structures, especially circuit boards, e.g. for use in mobile telephones, using energy radiation or energy pulses, specifically for chemical conversion of compound in substrate material

摘要

In the production of functional element (FE) structures, especially circuit boards, the FE structures are obtained using energy radiation or energy pulses, and in the case of circuit board structures at least one conduction path-free FE structure is obtained. Independent claims are included for: (a) FE structures obtained by the process; (b) circuit boards, conductive films, housings or molded interconnect devices (MID's) containing the FE structures in their substrate materials; the (c) devices containing the FE structures or the circuit boards, conductive films, housings or MID's; and the use of a copper complex (IA), selected from copper EDTA, bis-(2,3-butanedione-dixoimato), ethylene diamine, propanediamine, butanediamine, diethylene triamine, dipropylene triamine, dibutylene triamine, triethylene tetramine, tripropylene tetramine and tributylene tetramine complexes, and/or an intrinsically conductive polymer (ICP) (especially polyaniline) (IB) for preparation of FE structures, as chemical compound (I) in a substrate material of circuit boards, conductive films, housings or MID's or in the above process.