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Material composition, useful for the production of molded parts, comprises silicon containing polymer, which is formed by cross-linking silicon containing structures under UV-radiation in a continuous manufacturing method
Material composition, useful for the production of molded parts, comprises silicon containing polymer, which is formed by cross-linking silicon containing structures under UV-radiation in a continuous manufacturing method
Material composition (A) for the production of molded parts, with formation of a cross linked polymer material, comprises at least one silicon containing polymer (I), which is formed by cross-linking silicon containing structures under UV-radiation in a continuous manufacturing method. An independent claim is also included for a method for cross-linking (I) comprising plasticizing (I) and forming molded parts in a continuous manufacturing method (which exhibits: wall thickness of more than 0.5 mm; a manufacturing speed of 5-100 m/min under irradiation of UV light; wavelength of 120-450 nm; radiation intensity in the UV range of 10-100 W/cm and emission from at least monochromatic and/or polychromatic UV-radiation source, comprises a excimer-laser (xenon fluoride, xenon chloride, krypton fluoride, krypton chloride-laser), a excimer lamp (xenon chloride, krypton chloride or krypton bromide lamp), a mercury vapor lamp with microwave- or light arc stimulation, a mercury vapor lamp with iron or gallium-indium or gallium-lead doping), on which UV light contacts before or after hardening the plasticized (I) and which is cross-linked under formation of silicon containing structures, where after the UV cross-linking with cross-linking degree of 50-98% (preferably 70-80%) and/or the course deformation residue (measured according to DIN ISO 2285 at 70[deg]C) amounts to 10-50% (preferably 10-20%).
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机译:用于形成模制零件并形成交联聚合物材料的材料组合物(A)包含至少一种含硅聚合物(I),该聚合物是通过在连续生产中在紫外线辐射下使含硅结构交联而形成的方法。还包括一种独立的权利要求,涉及一种用于交联的方法(I),包括增塑(I)并以连续制造方法成型零件(其表现为:壁厚大于0.5 mm;制造速度为5-100 m紫外/分钟;波长为120-450 nm;紫外线强度为10-100 W / cm,并且至少来自单色和/或多色紫外线辐射源的发射,包括准分子激光(氙气)氟化物,氯化氙,氟化rypto,氯化rypto镭射),准分子灯(氯化氙,氯化rypto或溴化k lamp),具有微波或光弧刺激的汞蒸气灯,具有铁或镓的汞蒸气灯铟或镓铅掺杂),在增塑剂(I)硬化之前或之后紫外线会与之接触,并且在形成含硅结构的情况下会发生交联,之后的紫外线交联度为50- 98%(最好是70-80%)和/或路线变形残余物(根据DIN ISO 2285在70℃下测量)为10-50%(优选10-20%)。
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