An integrated circuit socket test structure embedded in a shipping and handling cover, and methods of testing integrated circuit sockets and circuitry using the same

摘要

An apparatus for enabling testing of electrical paths by circuitry is provided. The device may include a tester shipping and handling cover for a socket of the circuitry. The tester shipping and handling cover may include a conductive layer for capacitive coupling to an array of pins in the socket during testing. A method for testing continuity of electrical paths through circuitry is provided. In the method, one or more nodes of the circuitry are stimulated, contacts of a socket to the circuitry are capacitively coupled to a conductive layer of a shipping and handling cover mated with the socket, and an electrical characteristic is measured by a tester included with the shipping and handling cover is coupled to determine continuity of electrical paths through the circuitry.