Depositing semiconductor layers on a series of substrates comprises passing each substrate through a series of process chambers in which a single layer is deposited

摘要

Depositing semiconductor layers on a series of substrates comprises loading a series of carriers with one or more substrates in a loading chamber, transporting each carrier to a first process chamber in which a first layer is deposited, transporting each carrier through a series of further process chambers, each for depositing one futher layer, and transporting each carrier to an unloading chamber to remove the substrate(s), where the temperature in each process chamber remains unchanged during carrier changes. Independent claims are also included for: (1) apparatus for depositing semiconductor layers on a series of substrates, comprising a loading chamber for loading a series of carriers with one or more substrates, a series of process chambers, each with a gas inlet, a gas outlet, a closable loading and unloading opening and a heater, an unloading chamber for unloading the carriers, and conveyors for transporting the carriers through the process chambers to the unloading chamber, where only one layer is deposited in each process chamber and the temperature in each process chamber remains unchanged during carrier changes; (2) apparatus for depositing semiconductor layers on a series of substrates, comprising a loading chamber for loading a series of carriers with one or more substrates, a series of process chambers, each with a gas inlet, a gas outlet, a closable loading and unloading opening and a heater, an unloading chamber for unloading the carriers, and conveyors for transporting the carriers through the process chambers to the unloading chamber, where the conveyors have gas phase control elements to protect the substrates with a defined gas phase composition during transport; (3) apparatus for depositing semiconductor layers on a series of substrates, comprising a loading chamber for loading a series of carriers with one or more substrates, a series of process chambers, each with a gas inlet, a gas outlet, a closable loading and unloading opening and a heater, an unloading chamber for unloading the carriers, and conveyors for transporting the carriers through the process chambers to the unloading chamber, where only a single process step is performed in each process chamber.