Interconnection for test measurement and logical analysis systems and probes for integrated circuits has flexible layers with contact bumps sandwiching rigid layer with holes

摘要

An interconnection (100) comprises a rigid layer (102) with many through holes (112) joined on either side to a flexible layer (104,106) with many conductive contact bumps (108,110) positioned over the holes and with signal paths in the holes connecting the contact bumps in the flexible layers. Independent claims are also included for the following: (A) further interconnection systems as above;and (B) production processes for the above.