首页> 外国专利> Electronic component, has spring unit establishing electrical connection between board and support unit, mechanically and electrically connected with board or support unit and lying against support unit or board in prestressed manner

Electronic component, has spring unit establishing electrical connection between board and support unit, mechanically and electrically connected with board or support unit and lying against support unit or board in prestressed manner

机译:电子部件,具有弹簧单元,该弹簧单元在板和支撑单元之间建立电连接,与板或支撑单元机械和电连接,并以预应力方式抵靠支撑单元或板

摘要

The component has a spring unit (6) provided for establishing an electrical connection between a printed circuit board (2) and a support unit (5) supporting a semiconductor unit (4). The unit (6) is mechanically and electrically connected with the circuit board or the unit (5) by reflow soldering and lie against the unit (5) or circuit board at an electrical contact point (7) in a prestressed manner, where the unit (6) is designed as a helical spring. An independent claim is also included for a method for establishing an electric connection between a printed circuit board and a support unit supporting a semiconductor unit in an electronic component.
机译:该部件具有弹簧单元(6),该弹簧单元(6)用于在印刷电路板(2)和支撑半导体单元(4)的支撑单元(5)之间建立电连接。单元(6)通过回流焊接与电路板或单元(5)机械和电气连接,并以预应力方式在电接触点(7)上靠在单元(5)或电路板上。 (6)被设计为螺旋弹簧。还包括一种用于在印刷电路板与在电子部件中支撑半导体单元的支撑单元之间建立电连接的方法的独立权利要求。

著录项

  • 公开/公告号DE102005017849A1

    专利类型

  • 公开/公告日2006-10-26

    原文格式PDF

  • 申请/专利权人 SIEMENS AG;

    申请/专利号DE20051017849

  • 发明设计人 BAUDELOT ERIC;

    申请日2005-04-18

  • 分类号H01L23/48;H05K3/32;

  • 国家 DE

  • 入库时间 2022-08-21 21:20:17

相似文献

  • 专利
  • 外文文献
  • 中文文献
获取专利

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号